| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing semiconductors excellent in moldability, flame retardance, high-temperature storage characteristics, moisture resistant reliability and solder crack resistance without using a halogen-based flame retardant and an antimony compound. SOLUTION: This epoxy resin composition for sealing the semiconductors is characterized as comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) a phosphazene compound and (F) a Zr compound as essential components.
|
