| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in moldability, solder crack resistance, and flame retardance. SOLUTION: This composition for semiconductor sealing contains, as essential ingredients, (A) an epoxidation product of a modified phenol resin obtained by the polycondensation of a petroleum-derived heavy oil or a pitch, a formaldehyde polymer, and a phenol in the presence of an acid catalyst, (B) a phenol resin curing agent, (C) an inorganic filler, and (D) a cure accelerator.
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