| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer capable of controlling distribution of polishing quantity on the surface of a wafer. SOLUTION: On a carrier 23 for holding a wafer, plural heaters 26 (heating means) for separately heating respective parts of the carrier 23, temperature sensors 27 (temperature detecting means) for detecting temperature of the respective parts heated by the heaters 26, a polishing condition setter for setting polishing conditions, and a control device for controlling action of the heaters 26 are provided. By the control device, polishing performance when the wafer is polished using the carrier 23 in the polishing conditions set by the polishing condition setter is determined, and based on information of the polishing performance, temperature distribution in the carrier 23 for thermally deforming the carrier 23 into a suitable form for polishing the wafer is determined, so heating of the carrier 23 by the heaters 26 is controlled based on information of the temperature distribution and signals sent by the temperature sensors 27. |
