发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device comprising a dual polysilicon gate structure in which the P type polysilicon gate is connected with the N type polysilicon gate by a bilayer conductive wiring structure without any contact, thereby significantly contributing to high integration, and a method for fabricating the semiconductor device such that the production yield is improved.
申请公布号 US6333527(B2) 申请公布日期 2001.12.25
申请号 US20010867584 申请日期 2001.05.31
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 KIM JAE KAP
分类号 H01L23/522;B60N3/10;E05F5/00;H01L21/768;H01L21/8238;H01L23/528;H01L27/092;(IPC1-7):H01L29/76 主分类号 H01L23/522
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