发明名称 HEAT-SENSITIVE ADHESIVE AND HEAT-SENSITIVE ADHESIVE SHEET
摘要 PROBLEM TO BE SOLVED: To produce a heat-sensitive adhesive and a heat-sensitive adhesive sheet containing the same by finding a compound which can be tacky when heated through it is nontacky at normal temperature like a phthalic ester compound. SOLUTION: This heat-sensitive adhesive contains a thermoplastic resin and a sulfenamide compound represented by formula (1) or (2).
申请公布号 JP2001354941(A) 申请公布日期 2001.12.25
申请号 JP20000174682 申请日期 2000.06.12
申请人 TOYO INK MFG CO LTD 发明人 IIDA HIROYUKI
分类号 C09J7/02;C09J11/06;C09J201/00;(IPC1-7):C09J201/00 主分类号 C09J7/02
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