发明名称 |
HEAT-SENSITIVE ADHESIVE AND HEAT-SENSITIVE ADHESIVE SHEET |
摘要 |
PROBLEM TO BE SOLVED: To produce a heat-sensitive adhesive and a heat-sensitive adhesive sheet containing the same by finding a compound which can be tacky when heated through it is nontacky at normal temperature like a phthalic ester compound. SOLUTION: This heat-sensitive adhesive contains a thermoplastic resin and a sulfenamide compound represented by formula (1) or (2).
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申请公布号 |
JP2001354941(A) |
申请公布日期 |
2001.12.25 |
申请号 |
JP20000174682 |
申请日期 |
2000.06.12 |
申请人 |
TOYO INK MFG CO LTD |
发明人 |
IIDA HIROYUKI |
分类号 |
C09J7/02;C09J11/06;C09J201/00;(IPC1-7):C09J201/00 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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