| 发明名称 |
HYGROSCOPIC MOLDED ARTICLE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a material capable of absorbing easily and surely moisture penetrating into the inside of an apparatus such as an electronic device or the like. SOLUTION: The hydroscopic molded body is such a molded body that contains a moisture-absorbing agent and a resin component and that has one or two or more of through-holes.
|
| 申请公布号 |
JP2001354780(A) |
申请公布日期 |
2001.12.25 |
| 申请号 |
JP20000175746 |
申请日期 |
2000.06.12 |
| 申请人 |
DYNIC CORP |
发明人 |
KAWAGUCHI YOHEI;FUJIMORI MASAYUKI;OYAMA KANEHITO |
| 分类号 |
C08J7/04;B29C70/58;C08J5/00;C08K3/22;C08K3/30;C08K7/24;C08L101/12;H01G2/02;(IPC1-7):C08J5/00 |
主分类号 |
C08J7/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
