Multichip module having stacked chip arrangement

摘要

A multichip module mainly comprises two stacked chips disposed on and respectively wire bonded to a substrate or a lead frame. There are a plurality of electrically conductive bumps having base portions and pillar protruding portions interposed between the two chips. The conductive bumps are attached at their base portions to the bonding pads of the lower chip and connected at their pillar protruding portions to the backside surface of the upper chip so as to support the upper chip. In the multichip module of the present invention, the pillar protruding portions of bumps help to provide clearance between the two chips for keeping the upper chip from damaging the bonding wires of the lower chip.