| 摘要 |
A microelectronic component connection is made by providing a lead, extending along the surface of a first element such as a semiconductor chip or wafer, such that at least a part of the lead adheres to the surface of the first element. The adhesion between this part of the lead and the surface of the first element is released by altering the temperature of at least this part of the lead. This part of the lead can then be peeled away from the surface of the first element. This part of the lead may be connected to a second element such as a microelectronic connection component, and the lead may be deformed by moving the elements relative to one another.
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