发明名称 MULTIPLE METALLIC FOIL-COVERED PLATE SUITABLE FOR HOLING WITH CARBON DIOXIDE GAS LASER AND PRINTED WIRING BOARD USING MULTIPLE METALLIC FOIL-COVERED PLATE
摘要 PROBLEM TO BE SOLVED: To provide a metallic foil-covered plate, using a metallic foil, in which a through hole and/or a blind via hole can be opened by directly irradiating the plate with a carbon dioxide gas laser, even when the surface of the metallic foil is rubbed and cut as well as a highly integrated printed wiring board. SOLUTION: This multiple metallic foil-covered plate with the arranged metallic foil is prepared in such a way that the shiny face of the plate consisting of a copper layer, a nickel layer or a nickel alloy layer hest suitably becomes the nickel layer or the nickel alloy layer. In addition, the shiny face is directly irradiated with the carbon dioxide gas laser of such an output selected from the range of 5-60 mJ and thus the through hole and/or the blind via hole are opened to obtain the printed wiring board.
申请公布号 JP2001353813(A) 申请公布日期 2001.12.25
申请号 JP20000181458 申请日期 2000.06.16
申请人 MITSUBISHI GAS CHEM CO INC 发明人 IKEGUCHI NOBUYUKI
分类号 H05K1/09;B32B15/08;H05K1/03;H05K3/00;(IPC1-7):B32B15/08 主分类号 H05K1/09
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