| 摘要 |
There is disclosed a carrier module capable of accurately fixing IC device when the producted IC device is tested on the performance thereof. The carrier module includes a body having an insertion groove formed therein in a predetermined direction and holes, an elastic unit inserted and fixed to the insertion groove, for being elastically moved upward and downward, a latch installed on upper portion of the elastic means, for fixing an IC device, and a pin for fixing the latch by being inserted and fixed into the body, wherein the IC device is fixed or released by operation of the latch. The carrier module has a structure permitting the latches to be pressed at both sides thereof, and therefore the present invention provides an easy machining and assembling of the carrier module, and lowers the production cost by reducing the number of parts.
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