发明名称 |
Electrical interconnection package and method thereof |
摘要 |
The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.
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申请公布号 |
US6333563(B1) |
申请公布日期 |
2001.12.25 |
申请号 |
US20000587944 |
申请日期 |
2000.06.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JACKSON RAYMOND A.;CALL ANSON J.;COURTNEY MARK G.;DELAURENTIS STEPHEN A.;FAROOQ MUKTA S.;FAROOQ SHAJI;GOLDMANN LEWIS S.;MARTIN GREGORY B.;RAY SUDIPTA K. |
分类号 |
H01L23/498;H05K1/14;H05K3/28;H05K3/34;H05K3/36;(IPC1-7):H01L29/40 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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