| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an adhesive composition for semiconductors, which, while retaining excellent insulation properties, can achieve excellent adhesiveness, warpage prevention, and temperature cycle endurance, and to prepare an adhesive sheet and to provide a semiconductor device both prepared by using the same. SOLUTION: This adhesive composition contains, as an essential ingredient, a polyesteramide having ester groups in the main chain. Both the adhesive sheet and the semiconductor device are prepared by using the composition.</p> |
