BONDING METHOD USING MOISTURE-CURABLE ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a bonding method free from drawbacks of the prior arts and capable of exhibiting far improved bonding strength when two adherends comprising a vinyl chloride resin-based composition which provides no moisture (water) are mutually bonded using a moisture-curable adhesive. SOLUTION: This bonding method using a moisture-curable adhesive comprises applying or spraying a polymer emulsion exhibiting adhesive properties on the surface of a moisture-curable adhesive applied on the surface of one adherend comprising a vinyl chloride resin-based composition and/or on the surface not coated with the adhesive of another adherend comprising a vinyl chloride resin-based composition and subsequently pasting the adherends to each other.