| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive composition for flexible circuit boards, which is excellent in flexing properties, folding life, and adhesiveness. SOLUTION: This composition comprises a bisphenol epoxy resin, a novolak epoxy resin, a thermoplastic elastomer having glycidyl groups in the molecular chain but not at the molecular ends, a bisphenol epoxy resin or a phenoxy resin, an epoxy resin curing agent, a cure accelerator, an inorganic filler, and a solvent.
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