发明名称 LASER BEAM MACHINING SYSTEM
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining system with which the whole laser beam machining system is miniaturized and a laser beam machining is efficiently performed. SOLUTION: A force-fitting part 22, a laser beam welding part 23, and a laser beam cutting part 24 are disposed in sequence around a transporting part 21. A laser oscillator 25 is arranged on the side of the laser beam welding part 23 and the laser beam cutting part 24, and a switching part 26 is arranged between the laser beam welding part 23 and the laser beam cutting part 24. A laser beam is introduced from the laser oscillator 25 to the switching part 26 via a laser beam introducing pipe 35, and the laser beam is alternately introduced to the laser beam welding part 23 or the laser beam cutting part 24. A work W in which a tube 27 and a cap 28 are force-fitted at a force-fitting part 22 is transported to the laser beam welding part 23 via the transporting part 21, a laser beam welding is performed, and the work is cut with the laser beam at the laser beam cutting part 24 by being transported again via the transporting part 21, thus the work W is completed.</p>
申请公布号 JP2001353584(A) 申请公布日期 2001.12.25
申请号 JP20000175790 申请日期 2000.06.12
申请人 NIPPEI TOYAMA CORP 发明人 SAWADA YOSHINOBU
分类号 B23Q7/02;B23K26/00;B23K26/06;B23K26/067;B23K26/10;B23Q7/14;(IPC1-7):B23K26/00 主分类号 B23Q7/02
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