发明名称 |
Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes |
摘要 |
A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.
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申请公布号 |
US6333564(B1) |
申请公布日期 |
2001.12.25 |
申请号 |
US19990336747 |
申请日期 |
1999.06.21 |
申请人 |
FUJITSU LIMITED |
发明人 |
KATOH YOSHITSUGU;SATO MITSUTAKA;INOUE HIROSHI;ORIMO SEIICHI;OKADA AKIRA;KUBOTA YOSHIHIRO;ABE MITSUO;HAMANO TOSHIO;AIBA YOSHITAKA;FUJISAWA TETSUYA;SEKI MASAAKI;SHIBA NORIAKI |
分类号 |
H01L23/12;H01L21/56;H01L23/28;H01L23/29;H01L23/31;H01L23/433;H01L23/50;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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