| 发明名称 |
Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 摘要 |
A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.
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| 申请公布号 |
US6333554(B1) |
申请公布日期 |
2001.12.25 |
| 申请号 |
US19980014981 |
申请日期 |
1998.01.28 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KITAJIMA MASAYUKI;TAKESUE MASAKAZU;MURAOKA YOSHITAKA |
| 分类号 |
H01L21/60;H01L23/485;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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