发明名称 |
Semiconductor having high density packaging thereof |
摘要 |
A semiconductor device comprises a semiconductor IC chip provided with bond pads on its first surface, a wiring substrate provided with a through hole extending between the opposite surfaces thereof, conductive members electrically connecting the bond pads of the semiconductor IC chip to the conductive lines formed on the wiring substrate respectively, and a sealing resin coating coating the first surface of the semiconductor IC chip and the conductive members, and bonding the side surface of the semiconductor IC chip to the side surface of the through hole of the wiring substrate.
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申请公布号 |
US6333566(B1) |
申请公布日期 |
2001.12.25 |
申请号 |
US19990435486 |
申请日期 |
1999.11.08 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
NAKAMURA AKIO |
分类号 |
H01L21/60;H01L21/56;H01L21/68;H01L21/98;H01L23/28;H01L25/065;(IPC1-7):H01L23/12;H01L21/02;H01L23/34;H01L23/02;H05K1/18 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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