发明名称 Method for fabricating capacitor of semiconductor memory device
摘要 An improved capacitor for a semiconductor memory device for preventing a bridge between storage electrodes and enlarging a surface area of a capacitor can be manufactured by forming a second insulating layer on a first insulating layer including a plug, etching the second insulating layer to form a storage electrode opening by using a storage electrode formation mask until the plug and a part of the first insulating layer are exposed, forming a conductive spacer on the sidewalls of the storage electrode opening to connect electrically to the plug, and forming an HSG (hemispherical grain) layer on the surfaces of the conductive spacers and the plug. A capacitor according to the present invention enables the HSG layer to grow on an internal wall of a storage electrode, thereby preventing a micro-bridge between storage electrodes resulting from abnormal growth or over-growth of the HSG layer.
申请公布号 US6333241(B1) 申请公布日期 2001.12.25
申请号 US19990339379 申请日期 1999.06.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM HYEON-SOO
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/20 主分类号 H01L27/04
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