发明名称 METHOD FOR HEAT PEELING ADHEREND
摘要 PROBLEM TO BE SOLVED: To provide a heat peeling method, when an adherend is peeled by heat from a heat-peeling type self-adhesive sheet provided with a heat- expandable layer containing heat-expandable microspheres, which permits to peel easily only a part of adherends desired among plural adherends with the residual adherends kept in the state pasted to the self-adhesive sheet. SOLUTION: This method for heat peeling an adherend comprises peeling by heat an adherend from a heat-peeling type self-adhesive sheet provided with a heat-expandable layer containing heat-expandable microspheres, where a heat-shutoff means to shut off the heat is provided, except a part, between a heat source and the self-adhesive sheet, and a part of adherends are selectively peeled by heat of the heat source. As the heating means, for example, hot air, an electromagnetic wave such as infrared rays can be employed.
申请公布号 JP2001354918(A) 申请公布日期 2001.12.25
申请号 JP20000176176 申请日期 2000.06.12
申请人 NITTO DENKO CORP 发明人 ARIMITSU YUKIO;OSHIMA TOSHIYUKI;MURATA SHUTO;KIUCHI KAZUYUKI
分类号 C09J7/02;C09J11/00;C09J201/00;(IPC1-7):C09J7/02 主分类号 C09J7/02
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