Molded electronic assembly

摘要

A molded electronic assembly is formed from a first molded plastic portion including a component mounting plane and a plurality of non-coplanar surfaces, and a second molded plastic portion molded around the first molded plastic portion and including openings therein defining selected regions of the first molded plastic portion. Metallization is applied to the selected regions of the first molded plastic portion defining a network of electrically conductive traces and conductive regions providing electrical continuity over at least two of the non-coplanar surfaces. A battery is supported above the component mounting plane by stand-offs formed in the second molded plastic portion, and a circuit protection device is mounted in substantial contact with the battery. A method for assembling an electronic module is also described.