| 摘要 |
<p>A data substrate with a semiconductor chip (1) connected to a first conductor loop (2) having at least one turn, with a second conductor loop (3) having at least one turn, the cross sectional area of which has approximately the dimensions of the data substrate, in which the cross sectional area of the first conductor loop (2) has approximately the dimensions of the semiconductor chip (1) and the two conductor loops (2, 3) are inductively interconnected.</p> |
