| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method by which a circuit device, in which circuit elements can be packaged without using support substrates, such as printed board, ceramic substrate, flexible sheet, etc., can be manufactured. SOLUTION: After a plurality of conductor paths 51 are formed by forming separating grooves 61 on a conductive foil 60, the circuit elements 52 respectively constituting circuit devices 53 are mounted on the conductor paths 51, and the warping of the foil 60 is suppressed by separately coating the circuit devices 53 with an insulating resin 590, by using the foil 60 as a support substrate. Then the conductor paths 51 are separated as conductor paths 51 by removing the foil 60 under the separating grooves 61. |
