NON-CONTACT IC CARD AND METHOD FOR LOADING REINFORCING PLATE

摘要

PROBLEM TO BE SOLVED: To provide a non-contact IC card produced by a simple process, having uniform thickness and capable of loading reinforcing plates in the thickness direction of an IC chip. SOLUTION: On a film substrate 1 loaded with an IC card and stored in a card base material of the non-contact IC card, the reinforcing plates 10 to be loaded on the upper and lower faces of the IC chip are loaded on the IC chip simultaneously with resin sealing by a transfer molding method.