METHOD OF MANUFACTURING SEMICONDUCTOR WAFER AND CARRIER PLATE FOR DOUBLE-SIDE POLISHING

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor wafer which causes no irregularity in a wafer edge region. SOLUTION: The method of manufacturing a semiconductor wafer having a surface and backside by conducting a double-side polishing on a semiconductor wafer comprises: (a) the semiconductor wafer is treated with an HF aqueous solution to generate a hydrophobic surface on the semiconductor wafer; (b) an alkali abrasive is continuously supplied between lower and upper rotating surface plates pasted with abrasive cloth, the surface and backside of the semiconductor wafer having the hydrophobic surface are simultaneously polished, and the pH of the abrasive is kept between 8.5 and 12.5; (c) after a targeted level of polishing is achieved, a stopper agent is supplied onto the semiconductor wafer; and (d) the semiconductor wafer is removed from the surface plates.