摘要 |
PROBLEM TO BE SOLVED: To facilitate the processing of coordinate transformation among a plurality of coordinate systems on an inspection apparatus and to accurately measure errors, even in the case where objects to be inspected are brought in from a plurality of directions for accurately measuring errors, etc., which are inherent in the inspection apparatus. SOLUTION: When relating a mechanical coordinate system with a base 1 as the reference, a stage coordinate system with the reference point of a stage 2 for inspection as the origin, a camera coordinate system with the image pickup range of a CCD camera 4 as the reference, and a wafer coordinate system with the center of a semiconductor wafer 101 the origin to each other, transformation processing including a transformation matrix RT, which corresponds to the rotation of the semiconductor wafer 101 by a transfer mechanism 3 is performed to pick up the image of any point P in the wafer coordinate system on the semiconductor wafer 101 by the CCD camera 4. |