| 摘要 |
PROBLEM TO BE SOLVED: To provide a capacitor capable of having high versatility and improving reliability onto an electronic device packaging substrate. SOLUTION: This electronic device packaging substrate includes coaxial multilayer structure that is composed of a center conductive part 1, a cylindrical dielectric layer 2 that is formed around the center conductive part 1, and a cylindrical conductive layer that is formed around the cylindrical dielectric layer 2, and an insulation layer where a plurality of coaxial multilayer structures are mutually embedded at intervals. |
