METHOD FOR MOUNTING ELECTRONIC COMPONENT AND MOUNTED BODY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve mounting strength by easily forming a part shaped like a fillet in a method for mounting an electronic component using conductive adhesive. SOLUTION: Conductive adhesive 3 is simultaneously applied to an electrode part 2a of an opposite face 1a opposite to a circuit board 9 and an electrode 2b of an edge face 1b of an electronic component 1 by a screen printing method using a screen printing plate 6 whose open part is large, and this electronic component 1 is loaded on the circuit board 9. The conductive adhesive 3 is hardened so that the conductive adhesive 3 shaped like a fillet can be formed at the electrode part 2b of the edge face 1b.