发明名称 REMOVER FOR PHOTORESIST AND/OR ETCHING RESISTANT RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a remover which can remove a photoresist film or an etching resistant resin composition film remaining on the surface of a substrate after etching in a short time, does not cause the tarnish and corrosion of a metallic material used as the substrate and ensures easy washing work and easy waste water treatment because the remover does not use a chelating agent and is less liable to cause foaming in washing and in waste water treatment. SOLUTION: The remover consists of 1-10 wt.% one or more selected from polyols and their derivatives, 0.001-0.1 wt.% one or more selected from anionic surfactants, nonionic surfactants and fluorine-containing surfactants, 5-40 wt.% alkali hydroxide and the balance water.
申请公布号 JP2001350277(A) 申请公布日期 2001.12.21
申请号 JP20000168597 申请日期 2000.06.06
申请人 MITSUWAKA JUNYAKU KENKYUSHO:KK 发明人 SHIROYAMA MASAMI
分类号 G03F7/42;C09D9/00;C23F1/00;(IPC1-7):G03F7/42 主分类号 G03F7/42
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