| 摘要 |
PROBLEM TO BE SOLVED: To provide a conveying jig, having a surface of superior and satisfiable smoothness and to provide a method for manufacturing the same. SOLUTION: An Si wafer conveying jig for conveying an Si wafer comprises a composite material of Si and an SiC powder of a surface, which includes a contact part of the Si wafer of a part or an entirety conveyed with an Si layer. The method for manufacturing the Si wafer conveying jig comprises the steps of adding an organic binder to the SiC powder of a reinforcing material, mixing the binder with the powder, forming a preform of the mixed powder, impregnating the preform with an Si molten at 1,500 to 1,700 deg.C in a vacuum or argon atmosphere, simultaneously forming a Si layer on the part or entirety of the surface of the preform, and polishing the surface of the Si layer. |
