发明名称 Substrate fabrication by bonding a useful element of a first material to a support of a second material with the deposition of an interposed amorphous layer
摘要 Fabrication of substrates comprises an operation for bonding a useful element (10) of a first material on one face of a support (2) of a second material, then depositing an electroconducting amorphous material (6) on the face of the support destined to receive the element (10) or on the face of the useful element (10). The second material is less noble than the first material. The substrates are produced with one or more monocrystalline layers on a polycrystalline support and may then be of the same material. An Independent claim is included for a substrate made up of a useful element and a support made up of a polycrystalline material and incorporating an electroconducting amorphous material between the useful element and the support.
申请公布号 FR2810448(A1) 申请公布日期 2001.12.21
申请号 FR20000007755 申请日期 2000.06.16
申请人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES 发明人 AUBERTON HERVE ANDRE
分类号 C23C14/14;H01L21/02;H01L21/762;H01L27/12;H01L31/04;(IPC1-7):H01L23/14 主分类号 C23C14/14
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