| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a semiconductor device which has resistance to changeover aging can be manufactured through a simple process, in order to solve the problem of the change of the connection resistance between a semiconductor and metal balls caused by changeover when a semiconductor is connected electrically to metal balls, by bringing the semiconductor into contact with the balls at the time of mounting the semiconductor using an anisotropic conductive resin. SOLUTION: By making a film of a thermosetting resin 1 formed on a wiring board 5 carrying solder bumps 4 formed on be a surface and a semiconductor element 2 mounted on the board 5 by melting the solder bumps 4 heating, and then the element 2 is fixed on the board 5 through curing the resin 1, not only electrical connection and resin encapsulation can be made at the same time, but also accordingly the process can be simplified. In addition, since the electrical connection is obtained by a metallic bond by soldering, the change in the connection resistance due to changeover aging can be reduced significantly and a high reliability semiconductor device can be realized.
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