| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent failure in thermal treatment on a wafer even when a lamp 1 burns out, in a lamp processing apparatus for performing thermal treatment on the wafer 10. SOLUTION: On a disc 2 having a plurality of the lamps 1 disposed on a plurality of concentric circles even when any one of the lamps 1 burns out during treatment of the wafer, illumination is increased on lamps A, B, C, D, E, and F that are adjacent to the burned lamp to make up for illumination of a wafer region corresponding to the burned lamp, thereby achieving an even illumination distribution of the wafer.</p> |
