| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact semiconductor package that uses no lead whatsoever or has wire or has them in very small dimensions, and has superior radiation performance. SOLUTION: This semiconductor package is composed of resin 16, that contains a semiconductor element 11 and one portion of a metal plate 14 for radiation inside for integration, and the remaining part of the metal plate 14 for radiation that is exposed outside the resin. The package is connected to a circuit board 30 by an I/O terminal 13 that is exposed onto one surface of the resin 16, and the metal plate 14 for radiation is bonded onto a surface at a side opposite to the I/O terminal 13 of the semiconductor element 11 for connecting to the circuit board 30 outside the resin 16, thus radiating heat that is generated by the semiconductor element 11 to the circuit board 30. |
