| 摘要 |
PROBLEM TO BE SOLVED: To greatly improve the cooling efficiency of a semiconductor device, and at the same time, to ensure proper stability in a heat sink. SOLUTION: A heat transfer member 10 for the semiconductor device is inserted between a CPU 1 and a heat sink 2. The entire heat transfer member 10 for the semiconductor device is formed, in a nearly flat-plate shape, and a recessed part 11 for fitting the CPU 1 or a core part 1a of the CPU 1 is formed on a surface opposite to the CPU 1.
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