| 摘要 |
PROBLEM TO BE SOLVED: To make a highly reliable semiconductor device in which an anisotropic conductive film is jointed firmly to a chip and/or a circuit board via solder layers, and/or no short-circuiting occurs between electrodes on the chip and/or circuit board. SOLUTION: After the solder layers 13 are formed on one/or both end sections of conducting paths 11 of the anisotropic conductive film 1, the film substrate 12 of the film 1 is thermally melt-stuck to a semiconductor element 2 and to the circuit board 3, and thereafter, the solder layers 13 are thermally melt-stuck to the element 2 and/or the board 3.
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