发明名称 SWITCH SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a switch substrate with which a crevice or a step difference are not produced between a portion of a metal plate which constitutes a switch contact and the mold resin which constitute a case, even if hardness of a terminal plate is maintained high. SOLUTION: A switch contact board 20 made of the metal plate in which the switch contacts A1-A5 are formed, a terminal board 40 which contacts to a terminal contact section prepared in the switch contact board 20, and a case 50 made of mold resin built on the upper and lower sides of the switch contact board 20 in a condition that the switch contacts A1-A5 of the switch contact board 20 are exposed, are prepared. The thickness of the switch contact board 20 is constituted more thinly than the thickness of the terminal block 40.
申请公布号 JP2001351459(A) 申请公布日期 2001.12.21
申请号 JP20000170495 申请日期 2000.06.07
申请人 TEIKOKU TSUSHIN KOGYO CO LTD 发明人 KOGANEHIRA KAZUO;KAKO YASUTOSHI;MORITA KOZO
分类号 H01H19/58;H01H11/00;H01H11/06;(IPC1-7):H01H11/00 主分类号 H01H19/58
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