| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure adaptable to high frequency switch modules miniaturized also in future. SOLUTION: The invention is a switch circuit for switching over a transmitter circuit and a receiver circuit. The switch circuit has diodes and transmission lines as main components, the transmission lines are composed of electrode patterns and electrode patterns of a laminate of dielectric layers, the diodes are disposed on the laminate, and the layers of the laminate are electrically connected through through-holes, thus forming a high frequency switch module. This module can be miniaturized and formed in one chip structure, preferably using a laminate structure. Thus it is effective for miniaturizing the apparatus in dual-band portable telephones, etc. |
