| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure which is mounted with a light-receiving sensor, capable of realizing high-accuracy positioning and reduction in size. SOLUTION: The structure mounted with a light-receiving sensor is constituted of a semiconductor wafer, a light-receiving sensor formed on the first surface of the semiconductor wafer, a through-electrode passing through the semiconductor wafer and extending from the light-receiving sensor itself or a wiring connected to the light-receiving sensor to the bottom surface of the wafer which faces the first surface, a transparent protecting member disposed at a gap from the light-receiving sensor, and a sealing agent for adhesively fixing the protecting member to the first surface, in a region other than the light-receiving sensor. |
