| 摘要 |
PROBLEM TO BE SOLVED: To enable accurate polishing of a semiconductor chip formed relatively thick down to a desired thickness. SOLUTION: The chip polishing method for polishing a chip to a desired finish thickness uses a polishing apparatus 30 including at least a chuck table 37 for holding a work piece 25 to be processed and a polishing means 35 having a polishing wheel 40 disposed as opposed to the table 37. The method includes a step of forming a ring frame F at least larger in thickness than a chip finish one and having nearly the same thickness as the chip before being subjected to polishing, a step of accommodating a chip C in an interior space zone of the frame F and bonding a bonding member T to the frame F and chip C to integrate the frame F and chip C, a step of holding the frame F integral to the chip C to the chuck table 37, a step of polishing the frame F and chip C held to the table 37 by a polishing means 35, and a step of measuring the thickness of the frame F to indirectly detect the thickness of the chip C. |
