| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist peeling technique by which a resist can be removed from a substrate cleanly at a high reaction rate by giving little damage to the substrate. SOLUTION: While the substrate 1 is rotated, ozone-containing water 7 is continuously supplied to the central part of the substrate 1. In the ozone- containing water 7, an ozone gas is mixed in advance in a state of bubbles. When the ozone-containing water 7 is made to flow on the surface of the substrate 1, a resist deposited on the surface of the substrate 1 is efficiently removed. |
