发明名称 FORMED POLYURETHANE FOR ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT COATED THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide light formed polyurethane whose thickness is made almost equal in which the height (coat thinness) of a form can be easily adjusted even when this polyurethane is molded by open mold without damaging the original characteristics (moisture-proofness, water resistance, insulating performance, and impact absorbency or the like) of the polyurethane, and a method for manufacturing electronic components coated with the formed polyurethane, and a printed circuit board coated with the formed polyurethane. SOLUTION: This formed polyurethane whose forming magnification ranges from 1.1 to 2.5 times in an independent air-bubble type is, desirably, formed as the molded body of polyurethane compositions including a micro-balloon constituted by including forming agent in the hollow of a hollow sphere.
申请公布号 JP2001352156(A) 申请公布日期 2001.12.21
申请号 JP20000171156 申请日期 2000.06.07
申请人 ASAHI RUBBER:KK;MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAJO NORIAKI;TAKAGI KAZUHISA;SAEGUSA YOSHIFUSA;HAMAKAWA ETSUZO
分类号 B29C39/10;C08G18/00;H05K3/28;(IPC1-7):H05K3/28 主分类号 B29C39/10
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