| 摘要 |
PROBLEM TO BE SOLVED: To provide a movable mechanism that can cope with a recent request for thinning while maintaining strength for mounting to a reference part or a movable part and mounts a printed circuit board for preventing the following property of the movable part from being lost. SOLUTION: This movable mechanism consists of a first circuit 22 where a flexible wiring board 20 for connecting a support 10 that becomes the reference part and a sub chassis that becomes the movable part is mounted on the support 10, a second circuit part 24 that is mounted to the sub chassis, and a connection part 26 for connecting the first circuit part 22 and the second circuit part 24. The first and/or second circuit parts 22 and 24 are formed on a double-sided board, and at the same time the connection part 26 is formed on a single-sided board, thus easily following the movement of the sub chassis since a circuit part that is formed by the double-sided board maintains specific strength even if a flexible wiring board 20 that is made of such a flexible material as resin and at the same time the connection part 26 is formed by the single-sided board.
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