发明名称 POLISHING RATE ESTIMATING METHOD FOR COPPER CHEMICAL MECHANICAL COMPOSITION POLISHING SLURRY
摘要 PROBLEM TO BE SOLVED: To meet requirements for estimating polishing rate excessively acting on polishing characteristic of slurry and shortening time required for development by quantitative selection of organic acid, as slurry is experimentally adjusted to confirm slurry quality when a kind of or a plurality kinds of organic acid is selected for complex salt synthetic material, and further as research and development for the optimal slurry requires a lot of time. SOLUTION: The polishing rate of typical organic acid belonging to the same type as organic acid to be added to a copper chemical mechanical composite polishing slurry is measured, a relationship is obtained between a measured result and the logarithmic value of octanol/water distribution coefficient of the organic acid, and a polishing rate is calculated and estimated from the above relationship.
申请公布号 JP2001351887(A) 申请公布日期 2001.12.21
申请号 JP20000167606 申请日期 2000.06.05
申请人 NEC CORP 发明人 MIYAZAWA ICHIRO
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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