发明名称 METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND PHOTOMASK
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a wiring circuit board capable of efficiently forming a terminal by a simple structure and capable of enhancing productivity and to provide a photomask used in the method. SOLUTION: In the method for producing a wiring circuit board by forming a base layer 13 on a supporting substrate 12, forming a conductor layer 14 on the base layer 13, windowing the substrate 12 and the base layer 13 to disclose the surface of the conductor layer 14 and using the disclosed layer 14 as a terminal forming part 36, when the base layer 13 is formed, the thickness of a part 31 of the base layer 13 to be removed so as to disclose the conductor layer 14 is made thinner than that of the other part by exposing the part 31 and the other part with different light exposures using a photomask 32.
申请公布号 JP2001350272(A) 申请公布日期 2001.12.21
申请号 JP20000172033 申请日期 2000.06.08
申请人 NITTO DENKO CORP 发明人 ITO KENICHIRO;YAMATO TAKESHI
分类号 G03F1/00;G03F1/70;G03F7/20;H05K3/00;H05K3/40 主分类号 G03F1/00
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