| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate for mounting electronic components that increases the wiring density of the circumference of a recessed part for mounting, and at the same time easily carries out wire bonding. SOLUTION: In a substrate 40 for mounting electronic components, that has a recessed part 5 for mounting that is formed in a recessed shape on an insulating board 4 for mounting an electronic component 59, at least two strip patterns are provided. The strip patterns are arranged on the same plane of the insulating board 4, along the circumference of the recessed part 5 for mounting. At least one of the strip patterns is a first strip pattern 11 for connecting to a via hole 12, that is open in the strip pattern. At least the other is a second strip pattern 21 for connecting to a wall-surface pattern 22 that is formed on the wall surface of the recessed part 5 for mounting.</p> |
