| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board which can decrease a loop inductance and has high reliability; and its manufacturing method. SOLUTION: As a capacitor 20 is disposed within a printed wiring board, a distance of an IC chip 90 and the capacitor 20 can be reduced, and a loop inductance can be decreased. Furthermore, in a lamination core substrate 30, a second core substrate 12U and a third core substrate 12D are laminated in an upper and lower part of a first core substrate which accommodates a capacitor. Therefore, it is rugged, and a stress due to a difference in a thermal coefficient between the capacitor and a core substrate is given to an interlayer resin insulation layer 144, and cracks do not generate in a conductor circuit 158.</p> |
