ABRASIVE FOR SEMICONDUCTOR INSULATION FILM

摘要

PROBLEM TO BE SOLVED: To provide a high-quality abrasive for insulation film of a semiconductor which can increase a polishing speed while at the same time reducing scratches and dust when polishing an insulation film of a semiconductor by CMP method. SOLUTION: The abrasive for an insulation layer of a semiconductor consists of a slurry prepared by dispersing composite oxide particles of cerium and zirconium into an aqueous solution.