发明名称 METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PAD WIRING BOARD ELECTRONIC PHOTOGRAPH PHOTOSENSITIVE BODY
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic photograph type printed wiring board having a practical ultraviolet light sensitivity, and an electronic photograph photosensitive body. SOLUTION: A metal conductive layer is provided on an electric insulation base material, and an optical conductive layer containing an electric charge transport substance and an alkali soluble resin is provided in its upper layer, thereby providing an electronic photograph type printed wiring board which has a practical ultraviolet light sensitivity and is superior in a fine line repeatability.
申请公布号 JP2001352148(A) 申请公布日期 2001.12.21
申请号 JP20000168666 申请日期 2000.06.06
申请人 MITSUBISHI PAPER MILLS LTD 发明人 TAKADA MASAKAZU;HORIUCHI TAMOTSU;NAZUKA MASANORI
分类号 G03G5/05;G03G5/06;H05K3/06;(IPC1-7):H05K3/06 主分类号 G03G5/05
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