| 摘要 |
PROBLEM TO BE SOLVED: To provide a method, that can smoothly transfer a viscous aggregated object 3 that is put onto a support plate 2 for conveying to a body 1 to be transferred, to smoothly carry out transfer to the semiconductor device of a grease spacer or a heat sink, when the heat sink is brought into contact with the semiconductor device via the grease spacer for fixing. SOLUTION: The viscous aggregated object 3 is put onto the porous support plate 2 that can contain water and, at the same time, is pressed for spreading out the contained water, water is contained into the porous support plate 2, and the body 1 to be transferred is pressed against the viscous aggregated object 3 for elimination, thus transferring the viscous aggregated object 3 to the body 1 to be transferred.
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